Short localization in CPU FlipChip using thermal imaging and magnetic current imaging: Advanced fault isolation technique comparison

Jan Gaudestad, Antonio Orozco, Jack Chen. Short localization in CPU FlipChip using thermal imaging and magnetic current imaging: Advanced fault isolation technique comparison. In IEEE International Reliability Physics Symposium, IRPS 2015, Monterey, CA, USA, April 19-23, 2015. pages 3, IEEE, 2015. [doi]

@inproceedings{GaudestadOC15,
  title = {Short localization in CPU FlipChip using thermal imaging and magnetic current imaging: Advanced fault isolation technique comparison},
  author = {Jan Gaudestad and Antonio Orozco and Jack Chen},
  year = {2015},
  doi = {10.1109/IRPS.2015.7112801},
  url = {http://dx.doi.org/10.1109/IRPS.2015.7112801},
  researchr = {https://researchr.org/publication/GaudestadOC15},
  cites = {0},
  citedby = {0},
  pages = {3},
  booktitle = {IEEE International Reliability Physics Symposium, IRPS 2015, Monterey, CA, USA, April 19-23, 2015},
  publisher = {IEEE},
  isbn = {978-1-4673-7362-3},
}