Thomas Glatzl, Franz Kohl, Wilfried Hortschitz, Thilo Sauter. Concept of a thermal flow sensor integration on circuit board level. In Proceedings of 2013 IEEE 18th Conference on Emerging Technologies & Factory Automation, ETFA 2013, Cagliari, Italy, September 10-13, 2013. pages 1-4, IEEE, 2013. [doi]
@inproceedings{GlatzlKHS13,
title = {Concept of a thermal flow sensor integration on circuit board level},
author = {Thomas Glatzl and Franz Kohl and Wilfried Hortschitz and Thilo Sauter},
year = {2013},
doi = {10.1109/ETFA.2013.6648116},
url = {http://dx.doi.org/10.1109/ETFA.2013.6648116},
researchr = {https://researchr.org/publication/GlatzlKHS13},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {Proceedings of 2013 IEEE 18th Conference on Emerging Technologies & Factory Automation, ETFA 2013, Cagliari, Italy, September 10-13, 2013},
publisher = {IEEE},
}