LogNIC: A High-Level Performance Model for SmartNICs

Zerui Guo, Jiaxin Lin, Yuebin Bai, Daehyeok Kim, Michael M. Swift, Aditya Akella, Ming Liu. LogNIC: A High-Level Performance Model for SmartNICs. In Proceedings of the 56th Annual IEEE/ACM International Symposium on Microarchitecture, MICRO 2023, Toronto, ON, Canada, 28 October 2023 - 1 November 2023. pages 916-929, ACM, 2023. [doi]

@inproceedings{GuoLBKSAL23,
  title = {LogNIC: A High-Level Performance Model for SmartNICs},
  author = {Zerui Guo and Jiaxin Lin and Yuebin Bai and Daehyeok Kim and Michael M. Swift and Aditya Akella and Ming Liu},
  year = {2023},
  doi = {10.1145/3613424.3614291},
  url = {https://doi.org/10.1145/3613424.3614291},
  researchr = {https://researchr.org/publication/GuoLBKSAL23},
  cites = {0},
  citedby = {0},
  pages = {916-929},
  booktitle = {Proceedings of the 56th Annual IEEE/ACM International Symposium on Microarchitecture, MICRO 2023, Toronto, ON, Canada, 28 October 2023 - 1 November 2023},
  publisher = {ACM},
}