Hai Guo, Jun Yang, Jiaping Han. The Fit Between Value Proposition Innovation and Technological Innovation in the Digital Environment: Implications for the Performance of Startups. IEEE Trans. Engineering Management, 68(3):797-809, 2021. [doi]
@article{GuoYH21-0,
title = {The Fit Between Value Proposition Innovation and Technological Innovation in the Digital Environment: Implications for the Performance of Startups},
author = {Hai Guo and Jun Yang and Jiaping Han},
year = {2021},
doi = {10.1109/TEM.2019.2918931},
url = {https://doi.org/10.1109/TEM.2019.2918931},
researchr = {https://researchr.org/publication/GuoYH21-0},
cites = {0},
citedby = {0},
journal = {IEEE Trans. Engineering Management},
volume = {68},
number = {3},
pages = {797-809},
}