Minseok Ha, Samuel Graham. Development of a thermal resistance model for chip-on-board packaging of high power LED arrays. Microelectronics Reliability, 52(5):836-844, 2012. [doi]
@article{HaG12,
title = {Development of a thermal resistance model for chip-on-board packaging of high power LED arrays},
author = {Minseok Ha and Samuel Graham},
year = {2012},
doi = {10.1016/j.microrel.2012.02.005},
url = {http://dx.doi.org/10.1016/j.microrel.2012.02.005},
researchr = {https://researchr.org/publication/HaG12},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {52},
number = {5},
pages = {836-844},
}