Joy Halder, Nayeem Ahmed, Viktor Razilov, Emil Matús, Gerhard P. Fettweis. Routing in Multi-Chip Platforms with Hybrid Interconnects. In 18th IEEE International Symposium on Embedded Multicore/Many-core Systems-on-Chip, MCSoC 2025, Singapore, December 15-18, 2025. pages 282-288, IEEE, 2025. [doi]
@inproceedings{HalderARMF25,
title = {Routing in Multi-Chip Platforms with Hybrid Interconnects},
author = {Joy Halder and Nayeem Ahmed and Viktor Razilov and Emil Matús and Gerhard P. Fettweis},
year = {2025},
doi = {10.1109/MCSoC67473.2025.00053},
url = {https://doi.org/10.1109/MCSoC67473.2025.00053},
researchr = {https://researchr.org/publication/HalderARMF25},
cites = {0},
citedby = {0},
pages = {282-288},
booktitle = {18th IEEE International Symposium on Embedded Multicore/Many-core Systems-on-Chip, MCSoC 2025, Singapore, December 15-18, 2025},
publisher = {IEEE},
isbn = {979-8-3315-6571-8},
}