In-line metrology and inspection for process control during 3D stacking of IC's

Sandip Halder, Ingrid De Wolf, Alain Phommahaxay, Andy Miller, Mireille Maenhoudt, Gerald Beyer, Bart Swinnen, Eric Beyne. In-line metrology and inspection for process control during 3D stacking of IC's. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-4, IEEE, 2011. [doi]

@inproceedings{HalderWPMMBSB11,
  title = {In-line metrology and inspection for process control during 3D stacking of IC's},
  author = {Sandip Halder and Ingrid De Wolf and Alain Phommahaxay and Andy Miller and Mireille Maenhoudt and Gerald Beyer and Bart Swinnen and Eric Beyne},
  year = {2011},
  doi = {10.1109/3DIC.2012.6263006},
  url = {http://dx.doi.org/10.1109/3DIC.2012.6263006},
  researchr = {https://researchr.org/publication/HalderWPMMBSB11},
  cites = {0},
  citedby = {0},
  pages = {1-4},
  booktitle = {2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012},
  editor = {Mitsumasa Koyanagi and Morihiro Kada},
  publisher = {IEEE},
  isbn = {978-1-4673-2189-1},
}