The electromigration behavior of copper pillars for different current directions and pillar shapes

Christine S. Hau-Riege, You-Wen Yau, Kevin Caffey, Rajneesh Kumar, YangYang Sun, Andy Bao, Milind Shah, Lily Zhao, Omar Bchir, Ahmer Syed, Steve Bezuk. The electromigration behavior of copper pillars for different current directions and pillar shapes. In IEEE International Reliability Physics Symposium, IRPS 2015, Monterey, CA, USA, April 19-23, 2015. pages 5, IEEE, 2015. [doi]

@inproceedings{Hau-RiegeYCKSBS15,
  title = {The electromigration behavior of copper pillars for different current directions and pillar shapes},
  author = {Christine S. Hau-Riege and You-Wen Yau and Kevin Caffey and Rajneesh Kumar and YangYang Sun and Andy Bao and Milind Shah and Lily Zhao and Omar Bchir and Ahmer Syed and Steve Bezuk},
  year = {2015},
  doi = {10.1109/IRPS.2015.7112750},
  url = {http://dx.doi.org/10.1109/IRPS.2015.7112750},
  researchr = {https://researchr.org/publication/Hau-RiegeYCKSBS15},
  cites = {0},
  citedby = {0},
  pages = {5},
  booktitle = {IEEE International Reliability Physics Symposium, IRPS 2015, Monterey, CA, USA, April 19-23, 2015},
  publisher = {IEEE},
  isbn = {978-1-4673-7362-3},
}