Copper Through Silicon Vias Studied by Photo-elastic Scanning Infrared Microscopy

M. Herms, M. Wagner, Ingrid De Wolf. Copper Through Silicon Vias Studied by Photo-elastic Scanning Infrared Microscopy. Microelectronics Reliability, 64:330-335, 2016. [doi]

Authors

M. Herms

This author has not been identified. Look up 'M. Herms' in Google

M. Wagner

This author has not been identified. Look up 'M. Wagner' in Google

Ingrid De Wolf

This author has not been identified. Look up 'Ingrid De Wolf' in Google