Quality Issues of High Pin Count Fine Pitch VLSI Packages

Eugene R. Hnatek, Billy R. Livesay. Quality Issues of High Pin Count Fine Pitch VLSI Packages. In Proceedings International Test Conference 1989, Washington, D.C., USA, August 1989. pages 397-422, IEEE Computer Society, 1989.

@inproceedings{HnatekL89,
  title = {Quality Issues of High Pin Count Fine Pitch VLSI Packages},
  author = {Eugene R. Hnatek and Billy R. Livesay},
  year = {1989},
  researchr = {https://researchr.org/publication/HnatekL89},
  cites = {0},
  citedby = {0},
  pages = {397-422},
  booktitle = {Proceedings International Test Conference 1989, Washington, D.C., USA, August 1989},
  publisher = {IEEE Computer Society},
}