Hong Meng Ho, Wai Lam, Serguei Stoukatch, Petar Ratchev, Charles J. Vath, Eric Beyne. Direct gold and copper wires bonding on copper. Microelectronics Reliability, 43(6):913-923, 2003. [doi]
@article{HoLSRVB03,
title = {Direct gold and copper wires bonding on copper},
author = {Hong Meng Ho and Wai Lam and Serguei Stoukatch and Petar Ratchev and Charles J. Vath and Eric Beyne},
year = {2003},
doi = {10.1016/S0026-2714(03)00074-X},
url = {http://dx.doi.org/10.1016/S0026-2714(03)00074-X},
researchr = {https://researchr.org/publication/HoLSRVB03},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {43},
number = {6},
pages = {913-923},
}