Detection of wafer warpages during thermal processing in microlithography

Weng Khuen Ho, Arthur Tay, Ying Zhou, Kai Yang, Ni Hu. Detection of wafer warpages during thermal processing in microlithography. In 8th International Conference on Control, Automation, Robotics and Vision, ICARCV 2004, Kunming, China, 6-9 December 2004, Proceedings. pages 485-490, IEEE, 2004. [doi]

@inproceedings{HoTZYH04,
  title = {Detection of wafer warpages during thermal processing in microlithography},
  author = {Weng Khuen Ho and Arthur Tay and Ying Zhou and Kai Yang and Ni Hu},
  year = {2004},
  doi = {10.1109/ICARCV.2004.1468873},
  url = {http://dx.doi.org/10.1109/ICARCV.2004.1468873},
  researchr = {https://researchr.org/publication/HoTZYH04},
  cites = {0},
  citedby = {0},
  pages = {485-490},
  booktitle = {8th International Conference on Control, Automation, Robotics and Vision, ICARCV 2004, Kunming, China, 6-9 December 2004, Proceedings},
  publisher = {IEEE},
}