Reliability issues for flip-chip packages - researchr publication authors

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Paul S. Ho, Guotao Wang, Min Ding, Jie-Hua Zhao, Xiang Dai. Reliability issues for flip-chip packages. Microelectronics Reliability, 44(5):719-737, 2004. [doi]

This author has not been identified. Look up 'Paul S. Ho' in GoogleThis author has not been identified. Look up 'Guotao Wang' in GoogleThis author has not been identified. Look up 'Min Ding' in GoogleThis author has not been identified. Look up 'Jie-Hua Zhao' in GoogleThis author has not been identified. Look up 'Xiang Dai' in Google

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