O. Hölck, Jörg Bauer 0002, Olaf Wittler, Bernd Michel, Bernhard Wunderle. Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination. Microelectronics Reliability, 52(7):1285-1290, 2012. [doi]
@article{HolckBWMW12,
title = {Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination},
author = {O. Hölck and Jörg Bauer 0002 and Olaf Wittler and Bernd Michel and Bernhard Wunderle},
year = {2012},
doi = {10.1016/j.microrel.2012.03.019},
url = {http://dx.doi.org/10.1016/j.microrel.2012.03.019},
researchr = {https://researchr.org/publication/HolckBWMW12},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {52},
number = {7},
pages = {1285-1290},
}