Ying-Yu Hsu, Po-Chun Kuo, Chih-Lun Chuang, Po-Hao Chang, Hung-Hao Shen, Chen-Feng Chiang. A 7nm 0.46pJ/bit 20Gbps with BER 1E-25 Die-to-Die Link Using Minimum Intrinsic Auto Alignment and Noise-Immunity Encode. In 2021 Symposium on VLSI Circuits, Kyoto, Japan, June 13-19, 2021. pages 1-2, IEEE, 2021. [doi]
@inproceedings{HsuKCCSC21,
title = {A 7nm 0.46pJ/bit 20Gbps with BER 1E-25 Die-to-Die Link Using Minimum Intrinsic Auto Alignment and Noise-Immunity Encode},
author = {Ying-Yu Hsu and Po-Chun Kuo and Chih-Lun Chuang and Po-Hao Chang and Hung-Hao Shen and Chen-Feng Chiang},
year = {2021},
doi = {10.23919/VLSICircuits52068.2021.9492439},
url = {https://doi.org/10.23919/VLSICircuits52068.2021.9492439},
researchr = {https://researchr.org/publication/HsuKCCSC21},
cites = {0},
citedby = {0},
pages = {1-2},
booktitle = {2021 Symposium on VLSI Circuits, Kyoto, Japan, June 13-19, 2021},
publisher = {IEEE},
isbn = {978-4-86348-780-2},
}