Thermocline Analysis Based on Entropy Value Methods

Chengquan Hu, Yu Gou, Tong Zhang, Kai Wang, Lili He 0002, Yu Jiang. Thermocline Analysis Based on Entropy Value Methods. In James J. Park, Vincenzo Loia, Gangman Yi, Yunsick Sung, editors, Advances in Computer Science and Ubiquitous Computing - CSA/CUTE 2017, Taichung, Taiwan, 18-20 December. Volume 474 of Lecture Notes in Electrical Engineering, pages 335-340, Springer, 2017. [doi]

@inproceedings{HuGZW0J17a,
  title = {Thermocline Analysis Based on Entropy Value Methods},
  author = {Chengquan Hu and Yu Gou and Tong Zhang and Kai Wang and Lili He 0002 and Yu Jiang},
  year = {2017},
  doi = {10.1007/978-981-10-7605-3_55},
  url = {https://doi.org/10.1007/978-981-10-7605-3_55},
  researchr = {https://researchr.org/publication/HuGZW0J17a},
  cites = {0},
  citedby = {0},
  pages = {335-340},
  booktitle = {Advances in Computer Science and Ubiquitous Computing - CSA/CUTE 2017, Taichung, Taiwan, 18-20 December},
  editor = {James J. Park and Vincenzo Loia and Gangman Yi and Yunsick Sung},
  volume = {474},
  series = {Lecture Notes in Electrical Engineering},
  publisher = {Springer},
  isbn = {978-981-10-7605-3},
}