Chung-Hao Huang, Chun-Kai Chen, Lun-Hui Lee, Ming-Shing Lin. T-slot High-Impedance Surface structures for EMC of wireless products. In 9th International Conference on Information, Communications & Signal Processing, ICICS 2013, Tainan, Taiwan, December 10-13, 2013. pages 1-4, IEEE, 2013. [doi]
@inproceedings{HuangCLL13-3,
title = {T-slot High-Impedance Surface structures for EMC of wireless products},
author = {Chung-Hao Huang and Chun-Kai Chen and Lun-Hui Lee and Ming-Shing Lin},
year = {2013},
doi = {10.1109/ICICS.2013.6782808},
url = {http://dx.doi.org/10.1109/ICICS.2013.6782808},
researchr = {https://researchr.org/publication/HuangCLL13-3},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {9th International Conference on Information, Communications & Signal Processing, ICICS 2013, Tainan, Taiwan, December 10-13, 2013},
publisher = {IEEE},
}