DWDM nanophotonic interconnects: toward terabit/s chip-scale serial link

Tsung-Ching Huang, Cheng Li, Rui Wu, Chin-Hui Chen, Marco Fiorentino, Kwang-Ting Cheng, Samuel Palermo, Raymond G. Beausoleil. DWDM nanophotonic interconnects: toward terabit/s chip-scale serial link. In IEEE 58th International Midwest Symposium on Circuits and Systems, MWSCAS 2015, Fort Collins, CO, USA, August 2-5, 2015. pages 1-4, IEEE, 2015. [doi]

@inproceedings{HuangLWCFCPB15,
  title = {DWDM nanophotonic interconnects: toward terabit/s chip-scale serial link},
  author = {Tsung-Ching Huang and Cheng Li and Rui Wu and Chin-Hui Chen and Marco Fiorentino and Kwang-Ting Cheng and Samuel Palermo and Raymond G. Beausoleil},
  year = {2015},
  doi = {10.1109/MWSCAS.2015.7282211},
  url = {https://doi.org/10.1109/MWSCAS.2015.7282211},
  researchr = {https://researchr.org/publication/HuangLWCFCPB15},
  cites = {0},
  citedby = {0},
  pages = {1-4},
  booktitle = {IEEE 58th International Midwest Symposium on Circuits and Systems, MWSCAS 2015, Fort Collins, CO, USA, August 2-5, 2015},
  publisher = {IEEE},
  isbn = {978-1-4673-6558-1},
}