Yongle Huang, Yifei Luo, Fei Xiao, Binli Liu. Temperature monitoring inside IGBT modules at forward bias from the cross section and its finite element analysis. Microelectronics Reliability, 83:187-197, 2018. [doi]
@article{HuangLXL18-0,
title = {Temperature monitoring inside IGBT modules at forward bias from the cross section and its finite element analysis},
author = {Yongle Huang and Yifei Luo and Fei Xiao and Binli Liu},
year = {2018},
doi = {10.1016/j.microrel.2018.03.008},
url = {https://doi.org/10.1016/j.microrel.2018.03.008},
researchr = {https://researchr.org/publication/HuangLXL18-0},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {83},
pages = {187-197},
}