Assembly Options and Challenges for Electronic Products With Lead-Free Exemption

Chien-Ming Huang, Anto Raj, Michael D. Osterman, Michael G. Pecht. Assembly Options and Challenges for Electronic Products With Lead-Free Exemption. IEEE Access, 8:134194-134208, 2020. [doi]

@article{HuangROP20,
  title = {Assembly Options and Challenges for Electronic Products With Lead-Free Exemption},
  author = {Chien-Ming Huang and Anto Raj and Michael D. Osterman and Michael G. Pecht},
  year = {2020},
  doi = {10.1109/ACCESS.2020.3010771},
  url = {https://doi.org/10.1109/ACCESS.2020.3010771},
  researchr = {https://researchr.org/publication/HuangROP20},
  cites = {0},
  citedby = {0},
  journal = {IEEE Access},
  volume = {8},
  pages = {134194-134208},
}