Using Taguchi method to obtain the optimal design of heat dissipation mechanism for electronic component packaging - researchr publication authors

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De-Shau Huang, Wen-Bin Tu, Xiu-Ming Zhang, Liang-Te Tsai, Ti-Yuan Wu, Ming-Tzer Lin. Using Taguchi method to obtain the optimal design of heat dissipation mechanism for electronic component packaging. Microelectronics Reliability, 65:131-141, 2016. [doi]

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