Hailong Huang, Yi Wan, Kai Zhou. PCB thermal reliability characteristics analysis under ambient temperature. J. Comput. Meth. in Science and Engineering, 20(3):853-858, 2020. [doi]
@article{HuangWZ20-1,
title = {PCB thermal reliability characteristics analysis under ambient temperature},
author = {Hailong Huang and Yi Wan and Kai Zhou},
year = {2020},
doi = {10.3233/JCM-194033},
url = {https://doi.org/10.3233/JCM-194033},
researchr = {https://researchr.org/publication/HuangWZ20-1},
cites = {0},
citedby = {0},
journal = {J. Comput. Meth. in Science and Engineering},
volume = {20},
number = {3},
pages = {853-858},
}