Shi-Yu Huang, Zeng-Fu Zeng, Kun-Han Tsai, Wu-Tung Cheng. On-the-fly timing-aware built-in self-repair for high-speed interposer wires in 2.5-D ICs. In Giorgio Di Natale, editor, 19th IEEE European Test Symposium, ETS 2014, Paderborn, Germany, May 26-30, 2014. pages 1-2, IEEE, 2014. [doi]
@inproceedings{HuangZTC14,
title = {On-the-fly timing-aware built-in self-repair for high-speed interposer wires in 2.5-D ICs},
author = {Shi-Yu Huang and Zeng-Fu Zeng and Kun-Han Tsai and Wu-Tung Cheng},
year = {2014},
doi = {10.1109/ETS.2014.6847841},
url = {http://dx.doi.org/10.1109/ETS.2014.6847841},
researchr = {https://researchr.org/publication/HuangZTC14},
cites = {0},
citedby = {0},
pages = {1-2},
booktitle = {19th IEEE European Test Symposium, ETS 2014, Paderborn, Germany, May 26-30, 2014},
editor = {Giorgio Di Natale},
publisher = {IEEE},
}