Fumihiro Inoue, Harold Philipsen, Alex Radisic, Silvia Armini, Peter Leunissen, Hiroshi Miyake, Ryohei Arima, Tomohiro Shimizu, Toshiaki Ito, Hirofumi Seki, Yuko Shinozaki, Tomohiko Yamamoto, Shoso Shingubara. Low temperature through-Si via fabrication using electroless deposition. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-4, IEEE, 2011. [doi]
@inproceedings{InouePRALMASISSYS11,
title = {Low temperature through-Si via fabrication using electroless deposition},
author = {Fumihiro Inoue and Harold Philipsen and Alex Radisic and Silvia Armini and Peter Leunissen and Hiroshi Miyake and Ryohei Arima and Tomohiro Shimizu and Toshiaki Ito and Hirofumi Seki and Yuko Shinozaki and Tomohiko Yamamoto and Shoso Shingubara},
year = {2011},
doi = {10.1109/3DIC.2012.6262984},
url = {http://dx.doi.org/10.1109/3DIC.2012.6262984},
researchr = {https://researchr.org/publication/InouePRALMASISSYS11},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012},
editor = {Mitsumasa Koyanagi and Morihiro Kada},
publisher = {IEEE},
isbn = {978-1-4673-2189-1},
}