Thermal modeling of homogeneous embedded multi-core processors

Daniel Jaeckle, Axel Sikora. Thermal modeling of homogeneous embedded multi-core processors. In 2014 International Conference on Advances in Computing, Communications and Informatics, ICACCI 2014, Delhi, India, September 24-27, 2014. pages 588-593, IEEE, 2014. [doi]

@inproceedings{JaeckleS14,
  title = {Thermal modeling of homogeneous embedded multi-core processors},
  author = {Daniel Jaeckle and Axel Sikora},
  year = {2014},
  doi = {10.1109/ICACCI.2014.6968448},
  url = {http://dx.doi.org/10.1109/ICACCI.2014.6968448},
  researchr = {https://researchr.org/publication/JaeckleS14},
  cites = {0},
  citedby = {0},
  pages = {588-593},
  booktitle = {2014 International Conference on Advances in Computing, Communications and Informatics, ICACCI 2014, Delhi, India, September 24-27, 2014},
  publisher = {IEEE},
  isbn = {978-1-4799-3078-4},
}