MSV: Contribution of Modalities based on the Shapley Value

Jangyeong Jeon, Jungeun Kim, Jinwoo Park, Junyeong Kim. MSV: Contribution of Modalities based on the Shapley Value. In IEEE International Conference on Consumer Electronics, ICCE 2024, Las Vegas, NV, USA, January 6-8, 2024. pages 1-6, IEEE, 2024. [doi]

Authors

Jangyeong Jeon

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Jungeun Kim

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Jinwoo Park

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Junyeong Kim

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