Myeong-Hyeok Jeong, Jae-Won Kim, Byung-Hyun Kwak, Young-Bae Park, Byoung-Joon Kim, Young-Chang Joo. Electrical Reliability of Cu/Sn Micro-bump in Wafer Level Packaging for BioMEMS Devices. In Pedro Vieira, Ana L. N. Fred, Joaquim Filipe, Hugo Gamboa, editors, BIODEVICES 2011 - Proceedings of the International Conference on Biomedical Electronics and Devices, Rome, Italy, 26-29 January, 2011. pages 311-314, SciTePress, 2011.
@inproceedings{JeongKKPKJ11,
title = {Electrical Reliability of Cu/Sn Micro-bump in Wafer Level Packaging for BioMEMS Devices},
author = {Myeong-Hyeok Jeong and Jae-Won Kim and Byung-Hyun Kwak and Young-Bae Park and Byoung-Joon Kim and Young-Chang Joo},
year = {2011},
researchr = {https://researchr.org/publication/JeongKKPKJ11},
cites = {0},
citedby = {0},
pages = {311-314},
booktitle = {BIODEVICES 2011 - Proceedings of the International Conference on Biomedical Electronics and Devices, Rome, Italy, 26-29 January, 2011},
editor = {Pedro Vieira and Ana L. N. Fred and Joaquim Filipe and Hugo Gamboa},
publisher = {SciTePress},
isbn = {978-989-8425-37-9},
}