Shear properties of In-Bi alloy joints with Cu substrates during thermal aging

Sanghun Jin, Min-Su Kim, Shutetsu Kanayama, Hiroshi Nishikawa. Shear properties of In-Bi alloy joints with Cu substrates during thermal aging. Microelectronics Reliability, 88:795-800, 2018. [doi]

Authors

Sanghun Jin

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Min-Su Kim

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Shutetsu Kanayama

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Hiroshi Nishikawa

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