Overview and Future Challenges on III-V Integration Technologies in Silicon Photonics Platform

Richard Jones. Overview and Future Challenges on III-V Integration Technologies in Silicon Photonics Platform. In Optical Fiber Communications Conference and Exhibition, OFC 2021, San Francisco, CA, USA, June 6-10, 2021. pages 1-3, IEEE, 2021. [doi]

@inproceedings{Jones21-2,
  title = {Overview and Future Challenges on III-V Integration Technologies in Silicon Photonics Platform},
  author = {Richard Jones},
  year = {2021},
  url = {https://ieeexplore.ieee.org/document/9489565},
  researchr = {https://researchr.org/publication/Jones21-2},
  cites = {0},
  citedby = {0},
  pages = {1-3},
  booktitle = {Optical Fiber Communications Conference and Exhibition, OFC 2021, San Francisco, CA, USA, June 6-10, 2021},
  publisher = {IEEE},
  isbn = {978-1-943580-86-6},
}