A study of IR-drop noise issues in 3D ICs with through-silicon-vias

Moongon Jung, Sung Kyu Lim. A study of IR-drop noise issues in 3D ICs with through-silicon-vias. In IEEE International Conference on 3D System Integration, 3DIC 2010, Munich, Germany, 16-18 November 2010. pages 1-7, IEEE, 2010. [doi]

Authors

Moongon Jung

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Sung Kyu Lim

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