Efficient Patch Module for Single-bank or Dual-bank Firmware Updates for Embedded Devices

Ondrej Kachman, Marcel Baláz. Efficient Patch Module for Single-bank or Dual-bank Firmware Updates for Embedded Devices. In 23rd International Symposium on Design and Diagnostics of Electronic Circuits & Systems, DDECS 2020, Novi Sad, Serbia, April 22-24, 2020. pages 1-6, IEEE, 2020. [doi]

@inproceedings{KachmanB20,
  title = {Efficient Patch Module for Single-bank or Dual-bank Firmware Updates for Embedded Devices},
  author = {Ondrej Kachman and Marcel Baláz},
  year = {2020},
  doi = {10.1109/DDECS50862.2020.9095744},
  url = {https://doi.org/10.1109/DDECS50862.2020.9095744},
  researchr = {https://researchr.org/publication/KachmanB20},
  cites = {0},
  citedby = {0},
  pages = {1-6},
  booktitle = {23rd International Symposium on Design and Diagnostics of Electronic Circuits & Systems, DDECS 2020, Novi Sad, Serbia, April 22-24, 2020},
  publisher = {IEEE},
  isbn = {978-1-7281-9938-2},
}