Shigeru Kanazawa, Takeshi Fujisawa, Kiyoto Takahata, Hiroaki Sanjoh, Ryuzo Iga, Yuta Ueda, Wataru Kobayashi, Hiroyuki Ishii. 400-Gb/s operation of flip-chip interconnection EADFB laser array module. In Optical Fiber Communications Conference and Exhibition, OFC 2015, Los Angeles, CA, USA, March 22-26, 2015. pages 1-3, IEEE, 2015. [doi]
@inproceedings{KanazawaFTSIUKI15,
title = {400-Gb/s operation of flip-chip interconnection EADFB laser array module},
author = {Shigeru Kanazawa and Takeshi Fujisawa and Kiyoto Takahata and Hiroaki Sanjoh and Ryuzo Iga and Yuta Ueda and Wataru Kobayashi and Hiroyuki Ishii},
year = {2015},
url = {http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=7121880},
researchr = {https://researchr.org/publication/KanazawaFTSIUKI15},
cites = {0},
citedby = {0},
pages = {1-3},
booktitle = {Optical Fiber Communications Conference and Exhibition, OFC 2015, Los Angeles, CA, USA, March 22-26, 2015},
publisher = {IEEE},
isbn = {978-1-5575-2937-4},
}