Krzysztof Kasinski. Thermal and power delivery considerations of the 65k pixel 3-D integrated radiation imaging module with through-silicon vias. In 24th International Conference Mixed Design of Integrated Circuits and Systems, MIXDES 2017, Bydgoszcz, Poland, June 22-24, 2017. pages 435-439, IEEE, 2017. [doi]
No reviews for this publication, yet.