Hideto Kayashima, Hideharu Amano. Analysis of Resistance Distribution and Voltage Drop in Chips with Inductive Coupling Wireless Communication Interface. In Ninth International Symposium on Computing and Networking, CANDAR 2021 - Workshops, Matsue, Japan, 23-26 November 2021. pages 292-296, IEEE, 2021. [doi]
@inproceedings{KayashimaA21-0, title = {Analysis of Resistance Distribution and Voltage Drop in Chips with Inductive Coupling Wireless Communication Interface}, author = {Hideto Kayashima and Hideharu Amano}, year = {2021}, doi = {10.1109/CANDARW53999.2021.00055}, url = {https://doi.org/10.1109/CANDARW53999.2021.00055}, researchr = {https://researchr.org/publication/KayashimaA21-0}, cites = {0}, citedby = {0}, pages = {292-296}, booktitle = {Ninth International Symposium on Computing and Networking, CANDAR 2021 - Workshops, Matsue, Japan, 23-26 November 2021}, publisher = {IEEE}, isbn = {978-1-6654-2835-4}, }