System Design of a High-Temperature Downhole Transceiver: Part I - Receiver

Brannon Kerrigan, Fariborz Lohrabi Pour, Dong Sam Ha. System Design of a High-Temperature Downhole Transceiver: Part I - Receiver. In Hoi Lee, Randall L. Geiger, editors, 62nd IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2019, Dallas, TX, USA, August 4-7, 2019. pages 818-821, IEEE, 2019. [doi]

@inproceedings{KerriganPH19,
  title = {System Design of a High-Temperature Downhole Transceiver: Part I - Receiver},
  author = {Brannon Kerrigan and Fariborz Lohrabi Pour and Dong Sam Ha},
  year = {2019},
  doi = {10.1109/MWSCAS.2019.8885296},
  url = {https://doi.org/10.1109/MWSCAS.2019.8885296},
  researchr = {https://researchr.org/publication/KerriganPH19},
  cites = {0},
  citedby = {0},
  pages = {818-821},
  booktitle = {62nd IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2019, Dallas, TX, USA, August 4-7, 2019},
  editor = {Hoi Lee and Randall L. Geiger},
  publisher = {IEEE},
  isbn = {978-1-7281-2788-0},
}