Fabrication and bonding process of fine pitch Cu pillar bump on thin Si chip for 3D stacking IC - researchr publication authors

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Won-Myoung Ki, Myong-Suk Kang, Sehoon Yoo, Chang Woo Lee. Fabrication and bonding process of fine pitch Cu pillar bump on thin Si chip for 3D stacking IC. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-4, IEEE, 2011. [doi]

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