Gil-Su Kim, Katsuyuki Ikeuchi, Mutsuo Daito, Makoto Takamiya, Takayasu Sakurai. A high-speed, low-power capacitive-coupling transceiver for wireless wafer-level testing systems. In IEEE International Conference on 3D System Integration, 3DIC 2010, Munich, Germany, 16-18 November 2010. pages 1-4, IEEE, 2010. [doi]
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