Samyeon Kim, Seung Ki Moon. Disassembly Complexity-Driven Module Identification for Additive Manufacturing. In Chun-Hsien Chen, Amy J. C. Trappey, Margherita Peruzzini, Josip Stjepandic, Nel Wognum, editors, Transdisciplinary Engineering: A Paradigm Shift - Proceedings of the 24th ISPE Inc. International Conference on Transdisciplinary Engineering, TE 2017, Singapore, July 10-14, 2017. Volume 5 of Advances in Transdisciplinary Engineering, pages 782-789, IOS Press, 2017. [doi]
@inproceedings{KimM17-15,
title = {Disassembly Complexity-Driven Module Identification for Additive Manufacturing},
author = {Samyeon Kim and Seung Ki Moon},
year = {2017},
doi = {10.3233/978-1-61499-779-5-782},
url = {https://doi.org/10.3233/978-1-61499-779-5-782},
researchr = {https://researchr.org/publication/KimM17-15},
cites = {0},
citedby = {0},
pages = {782-789},
booktitle = {Transdisciplinary Engineering: A Paradigm Shift - Proceedings of the 24th ISPE Inc. International Conference on Transdisciplinary Engineering, TE 2017, Singapore, July 10-14, 2017},
editor = {Chun-Hsien Chen and Amy J. C. Trappey and Margherita Peruzzini and Josip Stjepandic and Nel Wognum},
volume = {5},
series = {Advances in Transdisciplinary Engineering},
publisher = {IOS Press},
isbn = {978-1-61499-779-5},
}