Warpage mechanism analyses of strip panel type PBGA chip packaging

Yeong K. Kim, In-Soo Park, Jooho Choi. Warpage mechanism analyses of strip panel type PBGA chip packaging. Microelectronics Reliability, 50(3):398-406, 2010. [doi]

Authors

Yeong K. Kim

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In-Soo Park

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Jooho Choi

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