Sung Woo Kim, Young-Jun Won, Dong-Sik Chae, Hyuk-Jae Chang. A New Fracture Liaison Service Using the Mobile Application and IoT Sensor. In 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2019, Berlin, Germany, July 23-27, 2019. pages 3486-3489, IEEE, 2019. [doi]
@inproceedings{KimWCC19,
title = {A New Fracture Liaison Service Using the Mobile Application and IoT Sensor},
author = {Sung Woo Kim and Young-Jun Won and Dong-Sik Chae and Hyuk-Jae Chang},
year = {2019},
doi = {10.1109/EMBC.2019.8857094},
url = {https://doi.org/10.1109/EMBC.2019.8857094},
researchr = {https://researchr.org/publication/KimWCC19},
cites = {0},
citedby = {0},
pages = {3486-3489},
booktitle = {41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2019, Berlin, Germany, July 23-27, 2019},
publisher = {IEEE},
isbn = {978-1-5386-1311-5},
}