Thermal stress analysis of die stacks with fine-pitch IMC interconnections for 3D integration - researchr publication authors

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Sayuri Kohara, Akihiro Horibe, Kuniaki Sueoka, Keiji Matsumoto, Fumiaki Yamada, Yasumitsu Orii, Katsuyuki Sakuma, Takahiro Kinoshita, Takashi Kawakami. Thermal stress analysis of die stacks with fine-pitch IMC interconnections for 3D integration. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-7, IEEE, 2011. [doi]

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