SLePaaS: An Embedded Platform-as-a-Service Facilitating Research on Thermal Management of Embedded Platforms

Rakesh Kumar 0012, Akash Sachan, Bibhas Ghoshal. SLePaaS: An Embedded Platform-as-a-Service Facilitating Research on Thermal Management of Embedded Platforms. IEEE Access, 10:90827-90846, 2022. [doi]

@article{KumarSG22,
  title = {SLePaaS: An Embedded Platform-as-a-Service Facilitating Research on Thermal Management of Embedded Platforms},
  author = {Rakesh Kumar 0012 and Akash Sachan and Bibhas Ghoshal},
  year = {2022},
  doi = {10.1109/ACCESS.2022.3201501},
  url = {https://doi.org/10.1109/ACCESS.2022.3201501},
  researchr = {https://researchr.org/publication/KumarSG22},
  cites = {0},
  citedby = {0},
  journal = {IEEE Access},
  volume = {10},
  pages = {90827-90846},
}