Design Consideration, Numerical and Experimental Analyses of Mode-Division-Multiplexed (MDM) Silicon Photonics Integrated Circuit with Sharp Bends

Pin-Cheng Kuo, Chi-Wai Chow, Yuan-Zeng Lin, Wahyu Hendra Gunawan, Tun-Yao Hung, Yin-He Jian, Guan-Hong Chen, Ching-Wei Peng, Yang Liu 0194, Chien-Hung Yeh. Design Consideration, Numerical and Experimental Analyses of Mode-Division-Multiplexed (MDM) Silicon Photonics Integrated Circuit with Sharp Bends. Sensors, 23(6):2965, March 2023. [doi]

@article{KuoCLGHJCPLY23,
  title = {Design Consideration, Numerical and Experimental Analyses of Mode-Division-Multiplexed (MDM) Silicon Photonics Integrated Circuit with Sharp Bends},
  author = {Pin-Cheng Kuo and Chi-Wai Chow and Yuan-Zeng Lin and Wahyu Hendra Gunawan and Tun-Yao Hung and Yin-He Jian and Guan-Hong Chen and Ching-Wei Peng and Yang Liu 0194 and Chien-Hung Yeh},
  year = {2023},
  month = {March},
  doi = {10.3390/s23062965},
  url = {https://doi.org/10.3390/s23062965},
  researchr = {https://researchr.org/publication/KuoCLGHJCPLY23},
  cites = {0},
  citedby = {0},
  journal = {Sensors},
  volume = {23},
  number = {6},
  pages = {2965},
}