3.2Tb/s Heterogeneous Photonic Integrated Circuit Chip in a Co-Packaged Optics Configuration - researchr publication authors

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Damien Lambert, Jeff Rahn, Majid Sodagar, Murtaza Askari, Paveen Apiratikul, John Y. Spann, Thang Pham, Yishen Huang, Stephen Krasulick. 3.2Tb/s Heterogeneous Photonic Integrated Circuit Chip in a Co-Packaged Optics Configuration. In Optical Fiber Communications Conference and Exhibition, OFC 2023, San Diego, CA, USA, March 5-9, 2023. pages 1-3, IEEE, 2023. [doi]

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