Christian Lang, Matthew Hiscock, Michael Dawson, Cheryl Hartfield. Local thickness and composition analysis of TEM lamellae in the FIB. Microelectronics Reliability, 54(9-10):1790-1793, 2014. [doi]
@article{LangHDH14,
title = {Local thickness and composition analysis of TEM lamellae in the FIB},
author = {Christian Lang and Matthew Hiscock and Michael Dawson and Cheryl Hartfield},
year = {2014},
doi = {10.1016/j.microrel.2014.07.043},
url = {http://dx.doi.org/10.1016/j.microrel.2014.07.043},
researchr = {https://researchr.org/publication/LangHDH14},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {54},
number = {9-10},
pages = {1790-1793},
}