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Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests

Tomi Laurila, Toni T. Mattila, V. Vuorinen, J. Karppinen, Jue Li, M. Sippola, Jorma K. Kivilahti. Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests. Microelectronics Reliability, 47(7):1135-1144, 2007. [doi]

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Tomi Laurila

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Toni T. Mattila

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V. Vuorinen

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J. Karppinen

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Jue Li

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M. Sippola

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Jorma K. Kivilahti

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