Huy Quoc Le, Willy Susilo, Thanh Xuan Khuc, Minh Kim Bui, Dung Hoang Duong. A Blind Signature from Module Latices. In 2019 IEEE Conference on Dependable and Secure Computing, DSC 2019, Hangzhou, China, November 18-20, 2019. pages 1-8, IEEE, 2019. [doi]
@inproceedings{LeSKBD19,
title = {A Blind Signature from Module Latices},
author = {Huy Quoc Le and Willy Susilo and Thanh Xuan Khuc and Minh Kim Bui and Dung Hoang Duong},
year = {2019},
doi = {10.1109/DSC47296.2019.8937613},
url = {https://doi.org/10.1109/DSC47296.2019.8937613},
researchr = {https://researchr.org/publication/LeSKBD19},
cites = {0},
citedby = {0},
pages = {1-8},
booktitle = {2019 IEEE Conference on Dependable and Secure Computing, DSC 2019, Hangzhou, China, November 18-20, 2019},
publisher = {IEEE},
isbn = {978-1-7281-2319-6},
}