Ho-Jin Lee, Min-Won Seo, Jungho Yi, Jong Mo Seo. Stretchability enhancement of electronics according to the surface patterns fabricated by thermal reflow process. In 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2019, Berlin, Germany, July 23-27, 2019. pages 1282-1285, IEEE, 2019. [doi]
No references recorded for this publication.
No citations of this publication recorded.