G. Lefranc, B. Weiss, C. Klos, J. Dick, G. Khatibi, H. Berg. Aluminum bond-wire properties after 1 billion mechanical cycles. Microelectronics Reliability, 43(9-11):1833-1838, 2003. [doi]
@article{LefrancWKDKB03,
title = {Aluminum bond-wire properties after 1 billion mechanical cycles},
author = {G. Lefranc and B. Weiss and C. Klos and J. Dick and G. Khatibi and H. Berg},
year = {2003},
doi = {10.1016/S0026-2714(03)00312-3},
url = {http://dx.doi.org/10.1016/S0026-2714(03)00312-3},
tags = {C++},
researchr = {https://researchr.org/publication/LefrancWKDKB03},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {43},
number = {9-11},
pages = {1833-1838},
}