Arne Leinse, Douwe Geuzebroek. Photonic Integrated Circuit Based Sensing Modules with Hybrid Integration in the Silicon Nitride TriPleX™ Platform. In Optical Fiber Communications Conference and Exhibition, OFC 2019, San Diego, CA, USA, March 3-7, 2019. pages 1-3, IEEE, 2019. [doi]
@inproceedings{LeinseG19,
title = {Photonic Integrated Circuit Based Sensing Modules with Hybrid Integration in the Silicon Nitride TriPleX™ Platform},
author = {Arne Leinse and Douwe Geuzebroek},
year = {2019},
url = {http://ieeexplore.ieee.org/document/8696523},
researchr = {https://researchr.org/publication/LeinseG19},
cites = {0},
citedby = {0},
pages = {1-3},
booktitle = {Optical Fiber Communications Conference and Exhibition, OFC 2019, San Diego, CA, USA, March 3-7, 2019},
publisher = {IEEE},
isbn = {978-1-943580-53-8},
}